IP Library Granted Patent US 6,731,463
Granted Patent Utility
US 6,731,463 · Confirmation No. 4381

WAFER FABRICATION FOR THERMAL POLE TIP EXPANSION/RECESSION COMPENSATION

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Code Description Pages PDF
2007-05-16 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2004-03-05 IFEE Issue Fee Payment (PTO-85B) 2 View
2002-01-08 TRNA Transmittal of New Application 1 View
2002-01-08 SPEC Specification 13 View
2002-01-08 CLM Claims 3 View
2002-01-08 ABST Abstract 1 View
2002-01-08 DRW Drawings-only black and white line drawings 5 View
2002-01-08 OATH Oath or Declaration filed 6 View
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Quick Facts
Patent No.
US 6,731,463
App. No.
10/041,357
Filed
2002-01-08
Granted
2004-05-04
Pub. No.
US20020145829A1
Art Unit
2652
PTA
0 days