IP Library › Patent Application 60365001
Patent Application Provisional
App. No. 60/365,001 · Confirmation No. 9651

Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2002-03-13 TRNA Transmittal of New Application 1 View
2002-03-13 SPEC Specification 30 View
2002-03-13 CLM Claims 3 View
2002-03-13 ABST Abstract 1 View
2002-03-13 DRW Drawings-only black and white line drawings 9 View
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Quick Facts
App. No.
60/365,001
Filed
2002-03-13