IP Library › Patent Application 60467863
Patent Application Provisional
App. No. 60/467,863 · Confirmation No. 1445

Molded door skins having reduced thickness and method of making same

Provisional Application Expired
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 Code Description Pages PDF
2003-05-05 TRNA Transmittal of New Application 2 View
2003-05-05 SPEC Specification 21 View
2003-05-05 DRW Drawings-only black and white line drawings 2 View
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Quick Facts
App. No.
60/467,863
Filed
2003-05-05