IP Library › Patent Application 60530423
Patent Application Provisional
App. No. 60/530,423 · Confirmation No. 8058

Multiple chip package module having inverted package stacked over die

Inventor: Marcos Karnezos
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2003-12-17 TRNA Transmittal of New Application 1 View
2003-12-17 SPEC Specification 17 View
2003-12-17 CLM Claims 1 View
2003-12-17 ABST Abstract 1 View
2003-12-17 DRW Drawings-only black and white line drawings 7 View
2003-12-17 ADS Application Data Sheet 3 View
2003-12-17 WFEE Fee Worksheet (SB06) 1 View
2003-12-17 ARTIFACT Artifact sheet indicating an item has been filed which cannot be scanned 1 View
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Quick Facts
App. No.
60/530,423
Filed
2003-12-17