Patent Assignment
Reel/Frame 015779/0484
Assignment of Assignor's Interest
Recorded: 2005-03-15
Pages: 3
Assignor
KARNEZOS, MARCOS
Executed: 2004-12-15
Assignee
CHIPPAC, INC.
47400 KATO ROAD, FREMONT, CALIFORNIA, 94538
Covered Properties
(2)
Multiple chip package module having inverted package stacked over die
Multiple chip package module having inverted package stacked over die
Application:
60/530,423 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger and Change of Name
Aug 6, 2015
From: CHIPPAC, INC.; STATS CHIPPAC, INC.
To: STATS CHIPPAC, INC.
Reel/Frame 036286/0612 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD
To: STATS CHIPPAC PTE. LTE
Reel/Frame 038378/0200 →
Release of Security Interest
Jun 4, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052844/0491 →