Patent Application
Provisional
App. No. 60/549,174
· Confirmation No. 3065
Method for manufacturing stacked chip package using film adhesive
Inventors:
Jin-Wook Jeong, In-Sang Yoon, Hee-Bong Lee, Hyun-Joon Oh, Hyeong Chan Kwon, Jong Wook Ju, Sang Ho Lee
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2004-03-02 | TRNA |
Transmittal of New Application | 2 | View | |
| 2004-03-02 | SPEC |
Specification | 8 | View | |
| 2004-03-02 | CLM |
Claims | 4 | View | |
| 2004-03-02 | ABST |
Abstract | 1 | View | |
| 2004-03-02 | DRW |
Drawings-only black and white line drawings | 6 | View | |
| 2004-03-02 | ADS |
Application Data Sheet | 5 | View | |
| 2004-03-02 | WFEE |
Fee Worksheet (SB06) | 1 | View |
Inventors
Jin-Wook Jeong
Ichon-si, KOREA, REPUBLIC OF
In-Sang Yoon
Ichon-si, KOREA, REPUBLIC OF
Hee-Bong Lee
Ichon-si, KOREA, REPUBLIC OF
Hyun-Joon Oh
Songpa-Gu, KOREA, REPUBLIC OF
Hyeong Chan Kwon
Seoul, KOREA, REPUBLIC OF
Jong Wook Ju
Kyoungnam, KOREA, REPUBLIC OF
Sang Ho Lee
Yeoju, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22470
- Docket No.
- CPAC 1083-1
- Confirmation No.
- 3065
from
LEE, HEE-BONG,
JEONG, JIN-WOOK,
JU, JONG WOOK,
KWON, HYEOG CHAN,
LEE, SANG HO,
YOON, IN-SANG,
OH, HYUN-JOON
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2005-06-01
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Quick Facts
- App. No.
- 60/549,174
- Filed
- 2004-03-02
External Links