Patent Assignment
Reel/Frame 016081/0907
Assignment of Assignor's Interest
Recorded: 2005-06-01
Pages: 7
Assignors
JEONG, JIN-WOOK
Executed: 2004-10-29
YOON, IN-SANG
Executed: 2004-10-29
LEE, HEE-BONG
Executed: 2004-10-24
OH, HYUN-JOON
Executed: 2005-05-26
KWON, HYEOG CHAN
Executed: 2004-10-29
JU, JONG WOOK
Executed: 2004-10-29
LEE, SANG HO
Executed: 2004-10-29
Assignee
CHIPPAC, INC.
47400 KATO ROAD, FREMONT, CALIFORNIA, 94538
Covered Properties
(2)
Semiconductor Chip Packaging Method with Individually Placed Film Adhesive Pieces
Method for manufacturing stacked chip package using film adhesive
Application:
60/549,174 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger and Change of Name
Aug 6, 2015
From: CHIPPAC, INC.; STATS CHIPPAC, INC.
To: STATS CHIPPAC, INC.
Reel/Frame 036286/0612 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD
To: STATS CHIPPAC PTE. LTE
Reel/Frame 038378/0200 →
Release of Security Interest
Jun 4, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052844/0491 →