IP Library › Patent Application 60626802
Patent Application Provisional
App. No. 60/626,802 · Confirmation No. 6488

Mitigation strategies for electromigration in solder bumps

Provisional Application Expired
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 Code Description Pages PDF
2004-11-10 TRNA Transmittal of New Application 2 View
2004-11-10 SPEC Specification 8 View
2004-11-10 CLM Claims 2 View
2004-11-10 DRW Drawings-only black and white line drawings 43 View
2004-11-10 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
60/626,802
Filed
2004-11-10