Patent Application
Provisional
App. No. 60/669,975
· Confirmation No. 8235
Semiconductor multipackage module including tape substrate land grid array package stacked over ball grid array package
Inventor:
Marcos Karnezos
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2005-04-11 | TRNA |
Transmittal of New Application | 1 | View | |
| 2005-04-11 | SPEC |
Specification | 7 | View | |
| 2005-04-11 | CLM |
Claims | 1 | View | |
| 2005-04-11 | ABST |
Abstract | 1 | View | |
| 2005-04-11 | DRW |
Drawings-only black and white line drawings | 5 | View | |
| 2005-04-11 | WFEE |
Fee Worksheet (SB06) | 1 | View | |
| 2005-04-11 | ADS |
Application Data Sheet | 2 | View |
Inventors
Marcos Karnezos
Palo Alto, CA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22470
- Docket No.
- CPAC 1090-1
- Confirmation No.
- 8235
Child
Claims priority from a provisional application
→
App. 12/059,077
· US 8,410,596
Filed 2008-03-31
· Patented Case
Child
Claims priority from a provisional application
→
App. 11/396,954
· US 7,589,407
Filed 2006-04-03
· Patented Case
Child
Claims priority from a provisional application
→
App. 12/511,012
· US 8,994,162
Filed 2009-07-28
· Patented Case
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Quick Facts
- App. No.
- 60/669,975
- Filed
- 2005-04-11
External Links