Semiconductor multipackage module including tape substrate land grid array package stacked over ball grid array package
A single metal layer tape substrate includes a patterned metal layer affixed to a patterned dielectric layer. The dielectric layer is patterned to provide openings exposing lands and bond sites on bond fingers on the land side of the metal layer. The metal layer is patterned to provide circuit traces as appropriate for interconnection with the die (on the die attach side) and with other elements (such as other packages in a multi-package module). Interconnection with a die is made by wire bonding to exposed traces on a die attach side of the metal layer, and bond fingers and lands for access to testing the package are provided on the opposite (land) side of the metal layer. In some embodiments a row of wire bond sites on the land side of adjacent bond fingers is exposed by a common opening in the dielectric layer, providing for a finer pitch interconnect and, accordingly, a higher interconnect density between stacked packages. Also a land grid array package having such a single metal layer tape substrate. Also, a multi-package module including such a single metal layer tape substrate land grid array package stacked over a ball grid array package. Methods for making the substrate are also disclosed.
1. A semiconductor package comprising:
a land grid array package with a single metal layer substrate further comprising:
a patterned dielectric layer,
a patterned metal layer affixed to the patterned dielectric layer, the patterned metal layer having a land side facing the dielectric layer and a die attach side opposite the land side,
circuit traces of the patterned metal layer for interconnection with a die on the die attach side, the circuit traces including bond fingers and lands, and
an opening of the patterned metal layer for exposing bond sites on lands on the land side of the metal layer;
the land grid array package inverted and stacked on a ball grid array package; and
wire bonds leading from exposed bond sites on the land side of the land grid array package for z-interconnection.
2. The single metal layer substrate of claim 1 wherein the dielectric layer has openings additionally exposing sites on bond fingers on the land side of the metal layer.
3. The single metal layer substrate of claim 2 wherein the opening exposing bond sites on bond fingers on the land side of the metal layer exposes a plurality of the bond sites.
4. The single metal layer substrate of claim 3 wherein the opening exposing bond sites on bond fingers on the land side of the metal layer comprises a slot.
5. The single metal layer substrate of claim 4 wherein a plurality of bond fingers traverses the slot.
6. The land grid array package, comprising a die mounted onto a die attach side of a single metal layer substrate of claim 1 .
7. The land grid array package, comprising a die mounted onto a die attach side of a single metal layer substrate of claim 2 .
8. The ball grid array package, comprising a die mounted onto a die attach side of a single metal layer substrate of claim 1 , and second level interconnects mounted at bond sites on the land side of the metal layer.
9. The ball grid array package, comprising a die mounted onto a die attach side of a single metal layer substrate of claim 2 , and second level interconnects mounted at bond sites on the land side of the metal layer.
10. The semiconductor package of claim 1 wherein the ball grid array package is a single metal layer ball grid array package.
11. An electronic device, comprising a package having a single metal layer tape substrate as in claim 1 , electrically connected to circuitry in the device.
12. An electronic device, comprising a multi-package module including a package having a single metal layer tape substrate as in claim 1 , the module being electrically connected to circuitry in the device.