Patent Application
Provisional
App. No. 60/678,553
· Confirmation No. 8297
Stacked package semiconductor module having packages stacked in a cavity in the module substrate
Inventor:
Sungmin Hong
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2005-05-04 | TRNA |
Transmittal of New Application | 1 | View | |
| 2005-05-04 | SPEC |
Specification | 4 | View | |
| 2005-05-04 | CLM |
Claims | 1 | View | |
| 2005-05-04 | ABST |
Abstract | 1 | View | |
| 2005-05-04 | DRW |
Drawings-only black and white line drawings | 5 | View | |
| 2005-05-04 | WFEE |
Fee Worksheet (SB06) | 1 | View | |
| 2005-05-04 | ADS |
Application Data Sheet | 2 | View |
Inventors
Sungmin Hong
Suwon-si, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22470
- Docket No.
- CPAC 1082-1
- Confirmation No.
- 8297
from
HONG, SUNGMIN
CORRECTIVE ASSIGNMENT TO CORRECT THE 2ND PG OF ASSIGNMENT (PREVIOUSLY SUBMITTED 2ND PG OF DECLARATION IN ERROR AS 2ND PG OF ASSIGN) PREVIOUSLY RECORDED ON REEL 017662 FRAME 0482. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Recorded 2008-01-03
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Quick Facts
- App. No.
- 60/678,553
- Filed
- 2005-05-04
External Links