Patent Assignment
Reel/Frame 020321/0268
Corrective Assignment to Correct the 2ND Pg of Assignment (Previously Submitted 2ND Pg of Declaration in Error as 2ND Pg of Assign) Previously Recorded on Reel 017662 Frame 0482. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2008-01-03
Pages: 9
Assignor
HONG, SUNGMIN
Executed: 2006-05-06
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Properties
(2)
Stacked Package Semiconductor Module Having Packages Stacked in a Cavity in the Module Substrate
Stacked package semiconductor module having packages stacked in a cavity in the module substrate
Application:
60/678,553 →
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 23, 2006
From: HONG, SUNGMIN
To: STATS CHIPPAC LTD.
Reel/Frame 017662/0482 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0309 →
Release of Security Interest
Jun 12, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052924/0007 →
Corrective Assignment to Correct the the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0309. Assignor(S) Hereby Confirms the Assignment.
Sep 11, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 065236/0767 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →