Patent Application
Provisional
App. No. 60/692,842
· Confirmation No. 2041
Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides
Inventor:
Marcos Karnezos
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2005-06-20 | TRNA |
Transmittal of New Application | 1 | View | |
| 2005-06-20 | SPEC |
Specification | 22 | View | |
| 2005-06-20 | CLM |
Claims | 1 | View | |
| 2005-06-20 | ABST |
Abstract | 1 | View | |
| 2005-06-20 | DRW |
Drawings-only black and white line drawings | 15 | View | |
| 2005-06-20 | WFEE |
Fee Worksheet (SB06) | 1 | View | |
| 2005-06-20 | ADS |
Application Data Sheet | 3 | View |
Inventors
Marcos Karnezos
Palo Alto, CA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22470
- Docket No.
- CPAC 1118-1.3
- Confirmation No.
- 2041
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 60/692,842
- Filed
- 2005-06-20
External Links