Patent Application
Provisional
Small
App. No. 60/895,305
· Confirmation No. 8113
Vertical Electrical Interconnect Formed On Substrate Prior to Die Mount
Provisional Application Expired
|
⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2007-03-29 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2007-03-16 | ADS |
Application Data Sheet | 4 | View | |
| 2007-03-16 | SPEC |
Specification | 7 | View | |
| 2007-03-16 | CLM |
Claims | 1 | View | |
| 2007-03-16 | ABST |
Abstract | 1 | View | |
| 2007-03-16 | DRW |
Drawings-only black and white line drawings | 8 | View | |
| 2007-03-16 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2007-03-16 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View |
Inventors
Terrence Caskey
Santa Cruz, CA
Lawrence Douglas Andrews JR.
Soquel, CA
Scott McGrath
Scotts Valley, CA
Simon J. S. McElrea
Scotts Valley, CA
Yong Du
Cupertino, CA
Mark Scott
Monte Sereno, CA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22470
- Docket No.
- VCIX 1024-1
- Confirmation No.
- 8113
Child
Claims priority from a provisional application
→
App. 12/046,651
· US 8,742,602
Filed 2008-03-12
· Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
Child
PCT
Claims priority from a provisional application
→
PCT/US2008/056633
Filed 2008-03-12
· RO PROCESSING COMPLETED-PLACED IN STORAGE
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 60/895,305
- Filed
- 2007-03-16
External Links