IP Library › Patent Application 60902545
Patent Application Provisional
App. No. 60/902,545 · Confirmation No. 3855

Multilayer printed wiring boards with copper filled through-holes

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2007-04-03 APP.FILE.REC Filing Receipt 3 View
2007-02-20 TRNA Transmittal of New Application 1 View
2007-02-20 SPEC Specification 10 View
2007-02-20 DRW Drawings-only black and white line drawings 6 View
2007-02-20 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
60/902,545
Filed
2007-02-20