Patent Application
Provisional
Small
App. No. 60/981,085
· Confirmation No. 3362
CHIP SCALE STACKED DIE PACKAGE
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2007-12-03 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2007-10-18 | ADS |
Application Data Sheet | 6 | View | |
| 2007-10-18 | SPEC |
Specification | 15 | View | |
| 2007-10-18 | CLM |
Claims | 1 | View | |
| 2007-10-18 | ABST |
Abstract | 1 | View | |
| 2007-10-18 | DRW |
Drawings-only black and white line drawings | 13 | View | |
| 2007-10-18 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2007-10-18 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Simon J.S. McElrea
Scotts Valley, UNITED KINGDOM
Marc E. Robinson
Scotts Valley, CA
Lawrence Douglas Andrews JR.
Soquel, CA
Terrence Caskey
Santa Cruz, CA
Scott McGrath
Scotts Valley, CA
Yong Du
Cupertino, CA
Al Vindasius
Saratoga, CA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22470
- Docket No.
- VCIX 1028-1
- Confirmation No.
- 3362
from
ROBINSON, MARC E,
ANDREWS, LAWRENCE DOUGLAS, JR,
MCGRATH, SCOTT,
MCELREA, SIMON J. S,
DU, YONG,
VINDASIUS, AL,
CASKEY, TERRENCE
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2008-12-23
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Quick Facts
- App. No.
- 60/981,085
- Filed
- 2007-10-18
External Links