Patent Assignment
Reel/Frame 022021/0936
Assignment of Assignor's Interest
Recorded: 2008-12-23
Pages: 8
Assignors
MCELREA, SIMON J. S
Executed: 2008-12-02
ROBINSON, MARC E
Executed: 2008-11-25
ANDREWS, LAWRENCE DOUGLAS, JR
Executed: 2008-11-26
CASKEY, TERRENCE
Executed: 2008-12-12
MCGRATH, SCOTT
Executed: 2008-11-26
DU, YONG
Executed: 2008-12-05
VINDASIUS, AL
Executed: 2008-12-11
Assignee
VERTICAL CIRCUITS, INC.
10 VICTOR SQUARE, SCOTTS VALLEY, CALIFORNIA, 95066
Covered Properties
(2)
Chip Scale Stacked Die Package
Application:
12/251,624 →
Publication:
US 2009/0102038
Chip Scale Stacked Die Package
Application:
60/981,085 →
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.