Patent Application
Provisional
App. No. 61/037,702
· Confirmation No. 9598
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INVERTED STACKED INTEGRATED CIRCUIT PACKAGE
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2008-03-27 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2008-03-18 | ADS |
Application Data Sheet | 5 | View | |
| 2008-03-18 | SPEC |
Specification | 7 | View | |
| 2008-03-18 | CLM |
Claims | 1 | View | |
| 2008-03-18 | ABST |
Abstract | 1 | View | |
| 2008-03-18 | DRW |
Drawings-only black and white line drawings | 3 | View | |
| 2008-03-18 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2008-03-18 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Hyunil Bae
Chungchung-do, KOREA, REPUBLIC OF
Youngchul Kim
Yongin-si, KOREA, REPUBLIC OF
Myung Kil Lee
Seoul, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22898
- Docket No.
- 27-524P
- Confirmation No.
- 9598
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2009-03-20
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Quick Facts
- App. No.
- 61/037,702
- Filed
- 2008-03-18
External Links