Patent Assignment
Reel/Frame 022430/0762
Assignment of Assignor's Interest
Recorded: 2009-03-20
Pages: 5
Assignors
BAE, HYUNIL
Executed: 2009-03-12
KIM, YOUNGCHUL
Executed: 2009-03-12
LEE, MYUNG KIL
Executed: 2009-03-12
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Properties
(2)
Integrated Circuit Packaging System with Package-in-Package and Method of Manufacture Thereof
Integrated Circuit Package System with Inverted Stacked Integrated Circuit Package
Application:
61/037,702 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0208 →
Release of Security Interest
Jun 4, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052844/0491 →
Corrective Assignment to Correct the Correct the Spelling of Assignee's Name from "Stats Chippac Pte. Lte." to "Stats Chippac Pte. Ltd." Previously Recorded at Reel: 038378 Frame: 0208. Assignor(S) Hereby Confirms the Assignment.
Sep 1, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064803/0387 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →