IP Library › Patent Application 61038900
Patent Application Provisional
App. No. 61/038,900 · Confirmation No. 5246

Robust UV-Cured SiN Etch Stop Layer with Low Hydrogen Release Technique for 45nm and Beyond

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2008-05-09 APP.FILE.REC Filing Receipt 3 View
2008-03-24 TR.PROV Provisional Cover Sheet (SB16) 2 View
2008-03-24 SPEC Specification 2 View
2008-03-24 WFEE Fee Worksheet (SB06) 2 View
2008-03-24 N417 Electronic Filing System Acknowledgment Receipt 2 View
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Quick Facts
App. No.
61/038,900
Filed
2008-03-24