Patent Application
Provisional
App. No. 61/057,203
· Confirmation No. 2521
SEMICONDUCTOR PACKAGE SYSTEM WITH COMMON PAD
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2008-06-09 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2008-05-30 | SPEC |
Specification | 9 | View | |
| 2008-05-30 | CLM |
Claims | 1 | View | |
| 2008-05-30 | ABST |
Abstract | 1 | View | |
| 2008-05-30 | DRW |
Drawings-only black and white line drawings | 7 | View | |
| 2008-05-30 | ADS |
Application Data Sheet | 5 | View | |
| 2008-05-30 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2008-05-30 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Zigmund Ramirez Camacho
Singapore, SINGAPORE
Henry Descalzo Bathan
Singapore, SINGAPORE
Lionel Chien Hui Tay
Singapore, SINGAPORE
Jose Alvin Caparas
Singapore, SINGAPORE
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22898
- Docket No.
- 27-545P
- Confirmation No.
- 2521
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2009-08-23
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Quick Facts
- App. No.
- 61/057,203
- Filed
- 2008-05-30
External Links