Integrated circuit packaging system with isolated pads and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: providing a lead frame having a die attach paddle, an isolated pad, and a connector; attaching an integrated circuit die to the die attach paddle and the connector; forming an encapsulation over the integrated circuit die, the connector, the die attach paddle, and the isolated pad; and singulating the connector and the die attach paddle whereby the isolated pads are electrically isolated.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a lead frame having a die attach paddle, an isolated pad, and a connector;
attaching an integrated circuit die to the die attach paddle and the connector;
forming an encapsulation over the integrated circuit die, the connector, the die attach paddle, and the isolated pad; and
singulating the connector and the die attach paddle whereby the isolated pads are electrically isolated by forming a cavity in to and exposed from the encapsulation.
2. The method as claimed in claim 1 wherein singulating the connector and the die attach paddle includes removing a portion of a tie bar attached to the isolated pad and the die attach paddle.
3. The method as claimed in claim 1 wherein singulating the connector and the die attach paddle includes removing a portion of a connecting bar attached to the isolated pad and a second isolated pad.
4. The method as claimed in claim 1 wherein singulating the connector and the die attach paddle includes removing a portion of a fused connector attached to the isolated pad, the isolated pad formed with a down set from the fused connector.
5. A method of manufacture of an integrated circuit packaging system comprising:
providing a lead frame having a die attach paddle, an isolated pad, and a connector;
mounting an integrated circuit die to the die attach paddle;
attaching an electrical interconnect to the integrated circuit die, the isolated pad, and the connector;
forming an encapsulation over the integrated circuit die, the connector, the die attached paddle, and the isolated pad; and
singulating the connector and the die attach paddle whereby the isolated pads are electrically isolated by forming a cavity in to and exposed from the encapsulation.
6. The method as claimed in claim 5 wherein forming an encapsulation includes forming an encapsulation providing a side of the isolated pad substantially exposed.
7. The method as claimed in claim 5 wherein forming an encapsulation includes forming an encapsulation providing a side of the die attach pad substantially exposed.
8. The method a claimed in claim 5 wherein forming an encapsulation includes forming an encapsulation providing a side of the isolated pad substantially exposed and a side of the die attach pad substantially exposed.
9. The method as claimed in claim 5 further comprising forming a second isolated pad separated from the isolated pad by the cavity.
10. An integrated circuit packaging system comprising:
a die attach paddle;
an isolated pad adjacent the die attach paddle;
a connector near the isolated pad and the die attach paddle;
an integrated circuit die attached to the die attach paddle and the connector;
a connecting bar attached to the isolated pad and another portion of the connecting bar attached to a second isolated pad; and
an encapsulation over the integrated circuit die, the connector, the die attach paddle, and the isolated pads with the connector, the die attach paddle, and the isolated pads electrically isolated having sides of the die attach paddle with characteristics of a formation process.
11. The system as claimed in claim 10 further comprising a portion of a tie bar attached to the isolated pad and another portion of the tie bar attached to the die attach paddle.
12. The system as claimed in claim 10 further comprising a portion of a fused connector attached to the isolated pad and another portion of the fused connector attached to a dam bar.
13. The system as claimed in claim 10 further comprising a fused connector attached to the isolated pad, the isolated pad formed with a down set from the fused connector.
14. The system as claimed in claim 10 further comprising an electrical interconnect to the integrated circuit die, the isolated pad, and the connector.
15. The system as claimed in claim 14 wherein the encapsulation provides a side of the isolated pad substantially exposed.
16. The system as claimed in claim 14 wherein the encapsulation provides a side of the die attach pad substantially exposed.
17. The system as claimed in claim 14 wherein the encapsulation provides a side of the isolated pad substantially exposed and a side of the die attach pad substantially exposed.
18. The system as claimed in claim 14 further comprising the second isolated pad separated from the isolated pad by a cavity.