WAFER-LEVEL FLIP CHIP PACKAGE WITH RF PASSIVE ELEMENT/ PACKAGE SIGNAL CONNECTION OVERLAY

Inventors: Ali Sarfaraz, Arya Reza Behzad

Provisional Application Expired

	Code	Description	Pages	PDF
2009-02-02	`APP.FILE.REC`	Filing Receipt	3	View
2009-01-19	`SPEC`	Specification	16	View
2009-01-19	`CLM`	Claims	2	View
2009-01-19	`ABST`	Abstract	1	View
2009-01-19	`TR.PROV`	Provisional Cover Sheet (SB16)	2	View
2009-01-19	`WFEE`	Fee Worksheet (SB06)	2	View
2009-01-19	`N417`	Electronic Filing System Acknowledgment Receipt	3	View
2009-01-19	`DRW`	Drawings-only black and white line drawings	12	View

Inventors

Ali Sarfaraz Alamo, CA

Arya Reza Behzad Poway, CA

Attorneys & Agents of Record

JOSEPH ZIEBERT Reg. 35421 Attorney · FOLEY & LARDNER LLP

COURTENAY BRINCKERHOFF Reg. 37288 Attorney · FOLEY & LARDNER LLP

PAVAN AGARWAL Reg. 40888 Attorney · FOLEY & LARDNER LLP

ANDREW MITCHELL Reg. 47358 Agent · FOLEY & LARDNER LLP

CHRISTOPHER MCKENNA Reg. 53302 Attorney · FOLEY & LARDNER LLP

BRETT BELDEN Reg. 57705 Attorney · FOLEY & LARDNER LLP

MENG PUA Reg. 63167 Attorney · FOLEY & LARDNER LLP

RICKY CHUN Reg. 63371 Attorney · BROADCOM CORPORATION

CHRISTOPHER HOHN Reg. 77179 Attorney · HOPKINS &CARLEY, A LAW CORPORATION

Prosecution

No recorded assignments were found for this patent.

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