Patent Application
Provisional
App. No. 61/157,550
· Confirmation No. 9584
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SOLDER RESIST PATTERNED SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2010-03-02 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2010-02-26 | PD.TO.AUTH |
Authorization or Rescission of Authorization to Access Application by Digital Access Service /Priority Document Exchange Office | 1 | View | |
| 2010-02-26 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2009-03-16 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2009-03-04 | ADS |
Application Data Sheet | 5 | View | |
| 2009-03-04 | SPEC |
Specification | 7 | View | |
| 2009-03-04 | CLM |
Claims | 1 | View | |
| 2009-03-04 | ABST |
Abstract | 1 | View | |
| 2009-03-04 | DRW |
Drawings-only black and white line drawings | 3 | View | |
| 2009-03-04 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2009-03-04 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Il Kwon Shim
Singapore, SINGAPORE
Seng Guan Chow
Singapore, SINGAPORE
Heap Hoe Kuan
Singapore, SINGAPORE
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22898
- Docket No.
- 27-638P
- Confirmation No.
- 9584
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2010-03-08
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Quick Facts
- App. No.
- 61/157,550
- Filed
- 2009-03-04
External Links