Patent Assignment
Reel/Frame 024040/0176
Assignment of Assignor's Interest
Recorded: 2010-03-08
Pages: 5
Assignors
SHIM, IL KWON
Executed: 2010-02-26
CHOW, SENG GUAN
Executed: 2010-02-26
KUAN, HEAP HOE
Executed: 2010-02-26
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Properties
(2)
Integrated Circuit Packaging System with Patterned Substrate and Method of Manufacture Thereof
Integrated Circuit Packaging System with Solder Resist Patterned Substrate and Method of Manufacture Thereof
Application:
61/157,550 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0442 →
Corrective Assignment to Correct the Assignor's Name Previously Recorded on Reel 038378 Frame 0442. Assignor(S) Hereby Confirms the Change of Name.
Jul 26, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 039514/0451 →
Corrective Assignment to Correct the Assignor Name Previously Recorded at Reel: 039514 Frame: 0451. Assignor(S) Hereby Confirms the Change of Name.
Aug 26, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 039980/0838 →
Release of Security Interest
Jun 17, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 053476/0094 →