Patent Application
Provisional
App. No. 61/178,838
· Confirmation No. 7262
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH REINFORCED ENCAPSULANT HAVING EMBEDDED INTERCONNECT AND METHOD OF MANUFACTURE THEREOF
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2010-05-10 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2010-05-06 | PD.TO.AUTH |
Authorization or Rescission of Authorization to Access Application by Digital Access Service /Priority Document Exchange Office | 1 | View | |
| 2010-05-06 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2009-06-04 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2009-05-15 | TR.PROV |
Provisional Cover Sheet (SB16) | 4 | View | |
| 2009-05-15 | SPEC |
Specification | 13 | View | |
| 2009-05-15 | CLM |
Claims | 1 | View | |
| 2009-05-15 | ABST |
Abstract | 1 | View | |
| 2009-05-15 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2009-05-15 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View | |
| 2009-05-15 | DRW |
Drawings-only black and white line drawings | 6 | View |
Inventors
Seng Guan Chow
Singapore, SINGAPORE
Il Kwon Shim
Singapore, SINGAPORE
Heap Hoe Kuan
Singapore, SINGAPORE
Youngcheol Kim
Youngin-si, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22898
- Docket No.
- 27-665P
- Confirmation No.
- 7262
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2010-06-18
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Quick Facts
- App. No.
- 61/178,838
- Filed
- 2009-05-15
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