Patent Assignment
Reel/Frame 024560/0244
Assignment of Assignor's Interest
Recorded: 2010-06-18
Pages: 6
Assignors
CHOW, SENG GUAN
Executed: 2010-05-11
SHIM, IL KWON
Executed: 2010-05-11
KUAN, HEAP HOE
Executed: 2010-05-11
KIM, YOUNGCHEOL
Executed: 2010-06-17
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Properties
(2)
Integrated Circuit Packaging System with Reinforced Encapsulant Having Embedded Interconnect and Method of Manufacture Thereof
Integrated Circuit Packaging System with Reinforced Encapsulant Having Embedded Interconnect and Method of Manufacture Thereof
Application:
61/178,838 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0219 →
Release of Security Interest
Jun 5, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052850/0237 →
Corrective Assignment to Correct the Correct the Spelling of Assignee's Name from "Stats Chippac Pte. Lte>" to "Stats Chippac Pte. Ltd" Previously Recorded at Reel: 038378 Frame: 0219. Assignor(S) Hereby Confirms the Assignment.
Sep 1, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064803/0300 →