Patent Application
Provisional
App. No. 61/178,864
· Confirmation No. 7335
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH REINFORCED ENCAPSULANT HAVING REINFORCED EMBEDDED INTERCONNECT AND METHOD OF MANUFACTURE THEREOF
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2009-05-26 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2009-05-15 | TR.PROV |
Provisional Cover Sheet (SB16) | 3 | View | |
| 2009-05-15 | SPEC |
Specification | 9 | View | |
| 2009-05-15 | CLM |
Claims | 1 | View | |
| 2009-05-15 | ABST |
Abstract | 1 | View | |
| 2009-05-15 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2009-05-15 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View | |
| 2009-05-15 | DRW |
Drawings-only black and white line drawings | 3 | View |
Inventors
Il Kwon Shim
Singapore, SINGAPORE
Seng Guan Chow
Singapore, SINGAPORE
Heap Hoe Kuan
Singapore, SINGAPORE
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22898
- Docket No.
- 27-666P
- Confirmation No.
- 7335
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2010-05-21
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Quick Facts
- App. No.
- 61/178,864
- Filed
- 2009-05-15
External Links