INTEGRATED CIRCUIT PACKAGING SYSTEM WITH COIN BONDED INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching an interconnect to the substrate; encapsulating the interconnect with an encapsulation leaving a portion of the interconnect not encapsulated; attaching a joint to the interconnect and simultaneously creating a coined-surface of the interconnect contacting the joint; and attaching an integrated circuit to the substrate.
1 . A method of manufacturing an integrated circuit packaging system comprising:
providing a substrate;
attaching an interconnect to the substrate;
encapsulating the interconnect with an encapsulation leaving a portion of the interconnect not encapsulated;
attaching a joint to the interconnect and simultaneously creating a coined-surface of the interconnect contacting the joint; and
attaching an integrated circuit to the substrate.
2 . The method as claimed in claim 1 wherein:
attaching the joint includes displacing material of the interconnect to laterally press against the encapsulation.
3 . The method as claimed in claim 1 wherein:
attaching the joint creating the coined-surface of the interconnect includes creating a first coined-surface of the interconnect; and
further comprising:
forming a second coined-surface of the joint when mounting the joint to the interconnect, and the second coined-surface is in direct contact with the first coined-surface of the interconnect.
4 . The method as claimed in claim 1 wherein:
attaching the joint includes attaching a t-shaped joint, a flat-shaped joint, a diamond-shaped joint, or a combination thereof.
5 . The method as claimed in claim 1 wherein:
attaching the joint creating the coined-surface of the interconnect includes creating part of the coined-surface in direct contact with a horizontal portion of the joint, coplanar with a top surface of the encapsulation.
6 . A method of manufacture of an integrated circuit packaging system comprising:
providing a substrate having a perimeter and a center portion;
attaching an interconnect to the substrate;
encapsulating the interconnect with an encapsulation leaving a portion of the interconnect not encapsulated;
attaching a joint to the interconnect and simultaneously creating a coined-surface of the interconnect contacting the joint; and
attaching an integrated circuit to the center portion of the substrate.
7 . The method as claimed in claim 6 wherein:
encapsulating includes leaving the center-portion of the substrate exposed from the encapsulation.
8 . The method as claimed in claim 6 wherein:
attaching the integrated circuit includes attaching a flip chip electrically connected to the substrate by solder balls; and
further comprising:
underfilling between the flip chip and the substrate with an under-fill.
9 . The method as claimed in claim 6 wherein:
encapsulating the interconnect leaving the portion of the interconnect exposed from the encapsulation includes encapsulating 40 to 70 percent of the height of the interconnect.
10 . The method as claimed in claim 6 wherein:
attaching the joint includes attaching the joint having a pointy tip submerged in the interconnect.
11 . The method as claimed in claim 6 wherein:
attaching the interconnect includes forming the interconnect of copper, gold, or silver studs, pillars, stacks of solder balls, or combinations thereof.
12 . An integrated circuit packaging system comprising:
a substrate;
an interconnect attached to the substrate;
an encapsulation that encapsulates the interconnect;
a joint attached to the interconnect with a coined-surface of the interconnect; and
an integrated circuit attached to the substrate.
13 . The system as claimed in claim 12 wherein:
the joint displaces material of the interconnect to laterally press against the encapsulation.
14 . The system as claimed in claim 12 wherein:
the coined-surface of the interconnect is a first coined-surface of the interconnect; and
further comprising:
a second coined-surface of the joint in direct contact with the first coined-surface of the interconnect.
15 . The system as claimed in claim 12 wherein:
the joint is a t-shaped joint, a flat-shaped joint, a diamond-shaped joint, or a combination thereof.
16 . The system as claimed in claim 12 wherein:
the coined-surface of the interconnect has part of the coined-surface in direct contact with a horizontal portion of the joint, coplanar with a top surface of the encapsulation.
17 . The system as claimed in claim 12 further comprising:
a perimeter and a center portion of the substrate; and
wherein:
the integrated circuit is attached to the center portion of the substrate.
18 . The system as claimed in claim 17 wherein:
the center-portion of the substrate is exposed from the encapsulation.
19 . The system as claimed in claim 17 wherein:
the integrated circuit is a flip chip electrically connected to the substrate with solder balls; and
further comprising:
an under-fill that fills between the flip chip and the substrate.
20 . The system as claimed in claim 17 wherein:
the coined-surface of the interconnect is in direct contact only with a pavilion poriton of the joint.
21 . The system as claimed in claim 17 wherein:
the joint has a pointy tip submerged in the interconnect.
22 . The system as claimed in claim 17 wherein:
the interconnect is formed of copper, gold, or silver studs, pillars, stacks of solder balls, or combinations thereof.