Patent Application
Provisional
Small
App. No. 61/194,090
· Confirmation No. 3487
Method of creating bonding sites with grooves/guard rings and different size stacks for eutectic wafer bonding
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2008-10-15 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2008-09-24 | TRNA |
Transmittal of New Application | 3 | View | |
| 2008-09-24 | ABST |
Abstract | 1 | View | |
| 2008-09-24 | SPEC |
Specification | 3 | View | |
| 2008-09-24 | DRW |
Drawings-only black and white line drawings | 5 | View | |
| 2008-09-24 | WFEE |
Fee Worksheet (SB06) | 1 | View |
Inventors
Prosecution
- Confirmation No.
- 3487
from
MICRO INERTIAL LLC
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2024-01-15
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Quick Facts
- App. No.
- 61/194,090
- Filed
- 2008-09-24
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