Patent Assignment
Reel/Frame 066305/0366
Assignment of Assignor's Interest
Recorded: 2024-01-15
Pages: 3
Assignor
MICRO INERTIAL LLC
Executed: 2023-12-21
Assignee
IP3 2023, SERIES 923 OF ALLIED SECURITY TRUST I
100 OVERLOOK CENTER, 2ND FLOOR, PRINCETON, NEW JERSEY, 08540
Covered Properties
(4)
Wafer Bonding Method and Wafer Stack Formed Thereby
Processes and Mounting Fixtures for Fabricating Electromechanical Devices and Devices Formed Therewith
Method of creating bonding sites with grooves/guard rings and different size stacks for eutectic wafer bonding
Application:
61/194,090 →
Method of creating three-axis IMU (Inertial Measurement Unit) by 3-D folding and assembling at wafer-level
Application:
61/457,319 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 24, 2009
From: MENG, GUANGQING (NMN); ZHANG, YAFAN (NMN); YAZDI, NAVID (NMN)
To: EVIGIA SYSTEMS, INC.
Reel/Frame 023561/0608 →
Assignment of Assignor's Interest
May 8, 2012
From: YAZDI, NAVID; ZHANG, YAFAN; ZHU, WEIBIN
To: EVIGIA SYSTEMS, INC.
Reel/Frame 028173/0386 →
Confirmatory License
Oct 6, 2016
From: EVIGIA SYSTEMS, INC.
To: GOVERNMENT OF THE UNITED STATES AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE
Reel/Frame 040243/0221 →
Assignment of Assignor's Interest
Sep 7, 2017
From: EVIGIA SYSTEMS INC.
To: MICRO INERTIAL LLC
Reel/Frame 043520/0859 →