IP Library › Assignment 040243/0221
Patent Assignment
Reel/Frame 040243/0221

Confirmatory License

Recorded: 2016-10-06 Pages: 3
Assignor
EVIGIA SYSTEMS, INC.
Executed: 2014-09-10
Assignee
GOVERNMENT OF THE UNITED STATES AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE
2240 B. STREET, BUILDING 11, AREA B, WRIGHT-PATTERSON AFB, OHIO, 45433-7109
Covered Properties (2)
Sensor and Sensing Method Utilizing Symmetrical Differential Readout
Patent: 8,056,413 →
Application: 12/208,402 →
Publication: US 2009/0064782
Wafer Bonding Method and Wafer Stack Formed Thereby
Patent: 8,119,498 →
Application: 12/565,298 →
Publication: US 2010/0072555
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 2, 2008
From: YAZDI, NAVID (NMN)
To: EVIGIA SYSTEMS, INC.
Reel/Frame 021621/0761 →
Assignment of Assignor's Interest Nov 24, 2009
From: MENG, GUANGQING (NMN); ZHANG, YAFAN (NMN); YAZDI, NAVID (NMN)
To: EVIGIA SYSTEMS, INC.
Reel/Frame 023561/0608 →
Assignment of Assignor's Interest Sep 7, 2017
From: EVIGIA SYSTEMS INC.
To: MICRO INERTIAL LLC
Reel/Frame 043520/0859 →
Assignment of Assignor's Interest Jan 15, 2024
From: MICRO INERTIAL LLC
To: IP3 2023, SERIES 923 OF ALLIED SECURITY TRUST I
Reel/Frame 066305/0366 →