Patent Assignment
Reel/Frame 023561/0608
Assignment of Assignor's Interest
Recorded: 2009-11-24
Pages: 3
Assignors
MENG, GUANGQING (NMN)
Executed: 2009-11-16
ZHANG, YAFAN (NMN)
Executed: 2009-11-17
YAZDI, NAVID (NMN)
Executed: 2009-11-16
Assignee
EVIGIA SYSTEMS, INC.
3810 VARSITY DR., ANN ARBOR, MICHIGAN, 48103
Covered Property
(1)
Wafer Bonding Method and Wafer Stack Formed Thereby
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Confirmatory License
Oct 6, 2016
From: EVIGIA SYSTEMS, INC.
To: GOVERNMENT OF THE UNITED STATES AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE
Reel/Frame 040243/0221 →
Assignment of Assignor's Interest
Sep 7, 2017
From: EVIGIA SYSTEMS INC.
To: MICRO INERTIAL LLC
Reel/Frame 043520/0859 →
Assignment of Assignor's Interest
Jan 15, 2024
From: MICRO INERTIAL LLC
To: IP3 2023, SERIES 923 OF ALLIED SECURITY TRUST I
Reel/Frame 066305/0366 →