IP Library › Patent Application 61260971
Patent Application Provisional
App. No. 61/260,971 · Confirmation No. 5677

WAFER BUMPING USING PRINTED UNDER BUMP METALIZATION

Inventors: Kunzhong Hu, Edward Law
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2009-11-23 APP.FILE.REC Filing Receipt 3 View
2009-11-13 DRW Drawings-only black and white line drawings 6 View
2009-11-13 TR.PROV Provisional Cover Sheet (SB16) 3 View
2009-11-13 SPEC Specification 9 View
2009-11-13 CLM Claims 3 View
2009-11-13 ABST Abstract 1 View
2009-11-13 WFEE Fee Worksheet (SB06) 2 View
2009-11-13 N417 Electronic Filing System Acknowledgment Receipt 3 View
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Quick Facts
App. No.
61/260,971
Filed
2009-11-13