Patent Application
Provisional
App. No. 61/286,099
· Confirmation No. 2416
Method for Forming Through-Base Wafer Vias For Fabrication of Stacked Devices
Provisional Application Expired
|
⬇ PDF
|
Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2011-01-18 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2011-01-11 | PD.TO.AUTH |
Authorization or Rescission of Authorization to Access Application by Digital Access Service /Priority Document Exchange Office | 2 | View | |
| 2011-01-11 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2010-01-08 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2009-12-14 | TR.PROV |
Provisional Cover Sheet (SB16) | 3 | View | |
| 2009-12-14 | SPEC |
Specification | 18 | View | |
| 2009-12-14 | CLM |
Claims | 3 | View | |
| 2009-12-14 | ABST |
Abstract | 1 | View | |
| 2009-12-14 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2009-12-14 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View |
Inventors
James Matthew Henry
Mesa, AZ
Daniel Hernandez Castillo II
Laveen, AZ
Attorneys & Agents of Record
Prosecution
- Customer No.
- 23543
- Docket No.
- 07401Z USA
- Confirmation No.
- 2416
No recorded assignments were found for this patent.
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
- App. No.
- 61/286,099
- Filed
- 2009-12-14
External Links