IP Library Patent Application 61293296
Patent Application Provisional Small
App. No. 61/293,296 · Confirmation No. 4897

SYSTEM AND METHOD FOR PROVIDING MULTI-CONDUCTIVE LAYER METALLIC INTERCONNECTS FOR SUPERCONDUCTING INTEGRATED CIRCUITS

Provisional Application Expired
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Code Description Pages PDF
2025-12-31 OATH Oath or Declaration filed 7 View
2010-02-02 APP.FILE.REC Filing Receipt 3 View
2010-01-08 TR.PROV Provisional Cover Sheet (SB16) 4 View
2010-01-08 ADS Application Data Sheet 5 View
2010-01-08 SPEC Specification 17 View
2010-01-08 CLM Claims 3 View
2010-01-08 ABST Abstract 1 View
2010-01-08 DRW.NONBW Drawings-other than black and white line drawings 7 View
2010-01-08 WFEE Fee Worksheet (SB06) 2 View
2010-01-08 N417 Electronic Filing System Acknowledgment Receipt 3 View
2010-01-08 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
0001-01-03 DRW.SUPP Drawings-black and white line and/or other drawings View
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Quick Facts
App. No.
61/293,296
Filed
2010-01-08