IP Library › Patent Application 61294474
Patent Application Provisional
App. No. 61/294,474 · Confirmation No. 9446

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADLESS CONTACTS AND METHOD OF MANUFACTURE THEREOF

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2010-01-25 APP.FILE.REC Filing Receipt 3 View
2010-01-12 TR.PROV Provisional Cover Sheet (SB16) 3 View
2010-01-12 SPEC Specification 7 View
2010-01-12 CLM Claims 1 View
2010-01-12 ABST Abstract 1 View
2010-01-12 DRW.NONBW Drawings-other than black and white line drawings 5 View
2010-01-12 WFEE Fee Worksheet (SB06) 2 View
2010-01-12 N417 Electronic Filing System Acknowledgment Receipt 3 View
2010-01-12 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
0001-01-03 DRW.SUPP Drawings-black and white line and/or other drawings — View
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Quick Facts
App. No.
61/294,474
Filed
2010-01-12