Patent Assignment
Reel/Frame 025467/0616
Assignment of Assignor's Interest
Recorded: 2010-12-08
Pages: 5
Assignors
CAMACHO, ZIGMUND RAMIREZ
Executed: 2010-12-01
BATHAN, HENRY DESCALZO
Executed: 2010-12-01
ESPIRITU, EMMANUEL
Executed: 2010-12-01
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Properties
(2)
Integrated Circuit Packaging System with Lead Interlocking Mechanisms and Method of Manufacture Thereof
Integrated Circuit Packaging System with Leadless Contacts and Method of Manufacture Thereof
Application:
61/294,474 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 13, 2010
From: CAMACHO, ZIGMUND RAMIREZ; BATHAN, HENRY DESCALZO; ESPIRITU, EMMANUEL
To: STATS CHIPPAC LTD.
Reel/Frame 025496/0138 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0244 →
Release of Security Interest
Jun 5, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052850/0237 →
Corrective Assignment to Correct the Assignee's Name on the Cover Sheet from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. Previously Recorded on Reel 038378 Frame 0244. Assignor(S) Hereby Confirms the Change of Name.
Aug 31, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 065239/0786 →