Patent Application
Provisional
App. No. 61/310,333
· Confirmation No. 2308
DIELECTRIC BOND PLIES FOR CIRCUITS AND MULTILAYER CIRCUITS, AND METHODS OF MANUFACTURE THEREOF
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2010-03-31 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2010-03-04 | SPEC |
Specification | 30 | View | |
| 2010-03-04 | CLM |
Claims | 5 | View | |
| 2010-03-04 | ABST |
Abstract | 1 | View | |
| 2010-03-04 | DRW |
Drawings-only black and white line drawings | 1 | View | |
| 2010-03-04 | TR.PROV |
Provisional Cover Sheet (SB16) | 3 | View | |
| 2010-03-04 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2010-03-04 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Dirk M. Baars
South Windsor, CT
Dale J. Doyle
Santee, CA
Sankar J. Paul
Branford, CT
Diana J. Williams
Queen Creek, AZ
Attorneys & Agents of Record
Prosecution
- Customer No.
- 23413
- Docket No.
- RP20018US (09O)
- Confirmation No.
- 2308
from
ROGERS CORPORATION
SECURITY AGREEMENT
Recorded 2010-12-02
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Quick Facts
- App. No.
- 61/310,333
- Filed
- 2010-03-04
External Links