Patent Assignment
Reel/Frame 025438/0057
Security Agreement
Recorded: 2010-12-02
Received: 2010-12-02
Pages: 7
Assignor
ROGERS CORPORATION
Executed: 2010-11-23
Assignee
JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
10 SOUTH DEARBORN, CHICAGO, IL, 60603, UNITED STATES
Covered Properties
(6)
Dielectric Materials, Methods of Forming Subassemblies Therefrom, and the Subassemblies Formed Therewith
Application:
12/813,556 →
Polishing Pad, Composition for the Manufacture Thereof, and Method of Making and Using
Application:
12/788,947 →
Integral Planar Transformer and Busbar
Application:
12/761,494 →
Circuit Laminates, and Method of Manufacture Thereof
Application:
61/316,093 →
Dielectric Bond Plies for Circuits and Multilayer Circuits, and Methods of Manufacture Thereof
Application:
61/310,333 →
Silicone Compositions, Methods of Manufacture, and Articles Formed Therefrom
Application:
12/709,078 →