IP Library Patent Application 61322198
Patent Application Provisional Small
App. No. 61/322,198 · Confirmation No. 1508

Method and Structure of Integrated Micro Electro-Mechanical Systems and Electronic Devices Using Edge Bond Pads

Provisional Application Expired
⬇ PDF
Code Description Pages PDF
2010-04-23 APP.FILE.REC Filing Receipt 3 View
2010-04-08 ADS Application Data Sheet 3 View
2010-04-08 SPEC Specification 19 View
2010-04-08 CLM Claims 6 View
2010-04-08 ABST Abstract 1 View
2010-04-08 DRW Drawings-only black and white line drawings 6 View
2010-04-08 WFEE Fee Worksheet (SB06) 2 View
2010-04-08 N417 Electronic Filing System Acknowledgment Receipt 2 View
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Quick Facts
App. No.
61/322,198
Filed
2010-04-08