IP Library › Patent Application 61545081
Patent Application Provisional
App. No. 61/545,081 · Confirmation No. 3807

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH THERMAL STRUCTURES AND METHOD OF MANUFACTURE THEREOF

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2011-12-02 APP.FILE.REC Filing Receipt 3 View
2011-11-23 CFILE Request for Corrected Filing Receipt 1 View
2011-11-23 TR.PROV Provisional Cover Sheet (SB16) 3 View
2011-11-23 CFILE Request for Corrected Filing Receipt 3 View
2011-11-23 N417 Electronic Filing System Acknowledgment Receipt 2 View
2011-10-24 APP.FILE.REC Filing Receipt 3 View
2011-10-07 TR.PROV Provisional Cover Sheet (SB16) 3 View
2011-10-07 SPEC Specification 10 View
2011-10-07 CLM Claims 1 View
2011-10-07 ABST Abstract 1 View
2011-10-07 DRW.NONBW Drawings-other than black and white line drawings 6 View
2011-10-07 WFEE Fee Worksheet (SB06) 2 View
2011-10-07 N417 Electronic Filing System Acknowledgment Receipt 3 View
2011-10-07 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
0001-01-03 DRW.SUPP Drawings-black and white line and/or other drawings — View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
App. No.
61/545,081
Filed
2011-10-07