Integrated circuit packaging system with thermal structures and method of manufacture thereof

1. An integrated circuit packaging system comprising:

a thermal attach cluster including:

a heat collector having a heat dissipation surface,

a cluster bridge, having a thermal surface, connected to the heat collector,

a cluster pad, having an attachment surface, connected to the end of the cluster bridge opposite the heat collector;

an isolation pad surrounded by the heat collector with the isolation pad physically separated from the heat collector by an isolation groove;

an integrated circuit connected to the thermal attach cluster; and

an encapsulation over the thermal attach cluster, the heat dissipation surface, the thermal surface, and the attachment surface exposed from and coplanar with the encapsulation.

2. The system as claimed in claim 1 further comprising a heat collector pad in the heat collector with the heat collector pad partially separated from the heat collector by a selective peripheral groove.

3. The system as claimed in claim 1 wherein the thermal surface has a surface area less than the surface area of the heat dissipation surface.

4. The system as claimed in claim 1 wherein the attachment surface includes a mounting recess.

5. The system as claimed in claim 1 wherein the encapsulation includes an encapsulation bottom side, the heat dissipation surface, the thermal surface, and the attachment surface exposed from and coplanar with the encapsulation bottom side.

6. The system as claimed in claim 5 wherein the thermal surface has a surface area less than the surface area of the attachment surface.

7. The system as claimed in claim 5 wherein the encapsulation includes the thermal attach cluster at a central region of the encapsulation bottom side.

8. The system as claimed in claim 5 further comprising terminal pads surrounding the thermal attach cluster.

9. The system as claimed in claim 5 further comprising attaching an external interconnect to the attachment surface.