IP Library › Patent Application 61546417
Patent Application Provisional
App. No. 61/546,417 · Confirmation No. 7475

MODIFY SOLDER PASTE PRINT APPROACH FOR PIN SOLDERING IN REFLOW APPLICATION

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2011-10-25 APP.FILE.REC Filing Receipt 3 View
2011-10-12 TR.PROV Provisional Cover Sheet (SB16) 3 View
2011-10-12 SPEC Specification 3 View
2011-10-12 WFEE Fee Worksheet (SB06) 2 View
2011-10-12 N417 Electronic Filing System Acknowledgment Receipt 2 View
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Quick Facts
App. No.
61/546,417
Filed
2011-10-12