IP Library › Patent Application 61549347
Patent Application Provisional
App. No. 61/549,347 · Confirmation No. 5207

MOLDED INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURE THEREOF

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2011-11-04 APP.FILE.REC Filing Receipt 3 View
2011-10-20 TR.PROV Provisional Cover Sheet (SB16) 3 View
2011-10-20 SPEC Specification 8 View
2011-10-20 CLM Claims 1 View
2011-10-20 ABST Abstract 1 View
2011-10-20 DRW.NONBW Drawings-other than black and white line drawings 4 View
2011-10-20 WFEE Fee Worksheet (SB06) 2 View
2011-10-20 N417 Electronic Filing System Acknowledgment Receipt 3 View
2011-10-20 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
0001-01-03 DRW.SUPP Drawings-black and white line and/or other drawings — View
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Quick Facts
App. No.
61/549,347
Filed
2011-10-20