Patent Assignment
Reel/Frame 028409/0349
Assignment of Assignor's Interest
Recorded: 2012-06-20
Pages: 5
Assignors
DO, BYUNG TAI
Executed: 2012-06-18
TRASPORTO, ARNEL SENOSA
Executed: 2012-06-18
CHUA, LINDA PEI EE
Executed: 2012-06-18
ESPIRITU, EMMANUEL
Executed: 2012-06-18
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Properties
(2)
Integrated Circuit Packaging System with Planarity Control and Method of Manufacture Thereof
Molded Integrated Circuit Package and Method of Manufacture Thereof
Application:
61/549,347 →
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Jul 22, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 039428/0928 →
Release of Security Interest
Jun 18, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052972/0001 →