IP Library › Patent Application 61711975
Patent Application Provisional
App. No. 61/711,975 · Confirmation No. 9056

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CORELESS SUBSTRATE AND METHOD OF MANUFACTURE THEREOF

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2013-01-16 OATH Oath or Declaration filed 8 View
2012-10-25 APP.FILE.REC Filing Receipt 3 View
2012-10-10 TR.PROV Provisional Cover Sheet (SB16) 3 View
2012-10-10 SPEC Specification 16 View
2012-10-10 CLM Claims 1 View
2012-10-10 ABST Abstract 1 View
2012-10-10 DRW.NONBW Drawings-other than black and white line drawings 9 View
2012-10-10 WFEE Fee Worksheet (SB06) 2 View
2012-10-10 N417 Electronic Filing System Acknowledgment Receipt 3 View
2012-10-10 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
0001-01-03 DRW.SUPP Drawings-black and white line and/or other drawings — View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
App. No.
61/711,975
Filed
2012-10-10