Patent Application
Provisional
Small
App. No. 61/978,824
· Confirmation No. 8550
Printed Circuit Board That Provides a Direct Thermal Path Between Components and a Thermal Layer and Method for Assembly
Inventor:
Kalu K. Vasoya
Applicant:
SinkPAD, LLC
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2014-05-01 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2014-04-11 | ADS |
Application Data Sheet | 7 | View | |
| 2014-04-11 | TR.PROV |
Provisional Cover Sheet (SB16) | 3 | View | |
| 2014-04-11 | SPEC |
Specification | 8 | View | |
| 2014-04-11 | CLM |
Claims | 3 | View | |
| 2014-04-11 | ABST |
Abstract | 1 | View | |
| 2014-04-11 | DRW |
Drawings-only black and white line drawings | 2 | View | |
| 2014-04-11 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2014-04-11 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Kalu K. Vasoya
Yorba Linda, CA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 8791
- Docket No.
- 9161P002Z
- Confirmation No.
- 8550
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Quick Facts
- App. No.
- 61/978,824
- Filed
- 2014-04-11
External Links