IP Library › Patent Application 62017434
Patent Application Provisional Small
App. No. 62/017,434 · Confirmation No. 2836

SYSTEM AND METHOD FOR THERMO-COMPRESSION BONDING OF HIGH BUMP COUNT SEMICONDUCTORS

Applicant: MRSI Systems, LLC
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2014-07-11 APP.FILE.REC Filing Receipt 3 View
2014-06-26 TR.PROV Provisional Cover Sheet (SB16) 3 View
2014-06-26 ADS Application Data Sheet 7 View
2014-06-26 SPEC Specification 17 View
2014-06-26 CLM Claims 5 View
2014-06-26 ABST Abstract 1 View
2014-06-26 DRW Drawings-only black and white line drawings 5 View
2014-06-26 WFEE Fee Worksheet (SB06) 2 View
2014-06-26 N417 Electronic Filing System Acknowledgment Receipt 3 View
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Quick Facts
App. No.
62/017,434
Filed
2014-06-26