Patent Application
Provisional
App. No. 62/280,037
· Confirmation No. 5786
METHOD AND PROCESS FOR REDUCING SOLDER BRIDGING BETWEEN SURFACE MOUNT TECHNOLOGY COMPONENTS
Inventors:
Paul A. Martinez, Curtis C. Mead, Scott D. Morrison, Giancarlo F. De La Cruz, Lin Chen, Albert Wang, Brad W. Simeral
Applicant:
Apple Inc.
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2016-02-19 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2016-01-18 | SPEC |
Specification | 4 | View | |
| 2016-01-18 | DRW |
Drawings-only black and white line drawings | 1 | View | |
| 2016-01-18 | ADS |
Application Data Sheet | 10 | View | |
| 2016-01-18 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2016-01-18 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View |
Inventors
Paul A. Martinez
Morgan Hill, CA
Curtis C. Mead
Sacramento, CA
Scott D. Morrison
Santa Cruz, CA
Giancarlo F. De La Cruz
San Jose, CA
Lin Chen
Saratoga, CA
Albert Wang
Sunnyvale, CA
Brad W. Simeral
San Francisco, CA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 73576
- Docket No.
- P29647USP1 / APPL:0635PRO
- Confirmation No.
- 5786
from
CHEN, LIN,
DE LA CRUZ, GIANCARLO F.,
CHEN, WYEMAN,
MORRISON, SCOTT D.,
VO, VU,
MARTINEZ, PAUL A.,
SIMERAL, BRAD W.,
WANG, ALBERT,
MEAD, CURTIS C.
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2017-01-18
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Quick Facts
- App. No.
- 62/280,037
- Filed
- 2016-01-18
External Links